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Methodology of Gate Voltage Selection for Power Loss Manipulation of Power Semiconductor Device

1 Department of Electrical Engineering, Indian Institute of Technology Bombay

2 Department of Electrical Engineering, Indian Institute of Technology Kanpur

Abhishek Chanekar1, Nachiketa Deshmukh1,2, Abhinav Arya1,2, Sandeep Anand1

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Presentation outline

  • Motivation
  • Literature Review
  • Static I-V Characteristics and Power Loss Manipulation
  • Desaturation Protection
  • Proposed Methodology and effect of Parameter variation
  • Simulation Results
  • Experimental Results
  • Conclusions

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Motivation: Reliability enhancement

  • Power electronics applications: Renewable generation, energy storage systems, battery chargers, electric vehicles, etc.
  • Reliability of power converters: To avoid frequent maintenance and unplanned downtime
  • Power Semiconductor Devices (PSDs): Most failure prone component
  • Changing ambient and loading conditions: Thermomechanical stresses generated from the Tj swings are main reasons for the failure of PSDs
  • Manipulating Tj profile: Reduction in stresses and increased lifetime of PSDs
  • S. Yang, et. al., “An industry-based survey of reliability in power electronic converters,” IEEE Trans. on Ind. Appl., vol. 47, no. 3, pp. 1441-1451, May/June 2011.
  • U.-M. Choi, et. al., “Study and handling methods of power igbt module failures in power electronic converter systems,” IEEE Transactions on Power Electronics, vol. 30, no. 5, pp. 2517–2533, 2015.

Failure distribution in PECs

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Literature review

Power loss manipulation using gate voltage: An effective method to reduce Tj swings

Tj swings manipulation

Thermal model from junction to ambient

    • Cooling fan speed control
    • Thermo-electric cooler module

    • Natural convection is a preferred choice in low power applications
    • Use of advanced cooling systems not a viable solution

Power loss in the PSDs

    • Active and reactive power sharing in parallel connected converters
    • Change in modulation strategy of the converter
    • DC-link voltage regulation
    • Switching frequency variation
    • Independent power loss manipulation of each PSD is challenging

    • Gate resistance manipulation: Smooth control very difficult and increases system complexity
    • Gate voltage manipulation
  • Z. Ni, X. Lyu, O. P. Yadav, B. N. Singh, S. Zheng, and D. Cao, “Overview of real-time lifetime prediction and extension for sic power converters,” IEEE Transactions on Power Electronics, vol. 35, no. 8, pp. 7765–7794, 2020.

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Static I-V characteristics

 

On-state drain-source voltage of MOSFET

Static ID-VDS characteristics showing key subparts of VDS at operating point C

 

R1: Component VR depends on drain current (ID) only

 

R2: Component VCh depends on ID and VGS

 

R3: Component VSCL depends on ID and VGS

 

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Power Loss manipulation

 

Power Loss in the MOSFET

 

Change in power loss by changing VGS

Change in VR due to VGS is zero

 

For a given ID, value of VCh (R2) and VSCL (R3) can be increased by reducing VGS

Varying the value of VDS, power losses can be manipulated at a given loading

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Desaturation protection

  • Gate-drivers have a safety feature of desaturation protection
  • The increase in VDS beyond the threshold limit during fault condition triggers the desaturation protection and turns-OFF the gate pulses.
  • However, during loss manipulation, the reduction of VGS causes increment in VDS which may increase beyond the threshold limit of the desaturation protection.
  • This would falsely trigger the desaturation protection and would cease the operation of the PSD unwillingly.

Desaturation protection enabled gate driver IC with DUT

During power losses manipulation of PSD by reducing VGS,

It is important to prevent the false triggering of the desaturation protection.

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Proposed Methodology

  • Initialization: Parameters RP , VTh , k, λ, and Vpro are obtained from device datasheet or characterization
  • Change is load current is monitored to initiate the power loss manipulation
  • ΔVGS defines the steps in which power loss manipulation is done
  • VDS is calculated at each step and compared with the pre-set threshold value of desaturation protection
  • The minimum value of VGS is passed to gate driver once the VDS exceeds Vpro

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  • For power loss manipulation, selected VGS at a given ID should ensure that the VDS should be less than Vpro.
  • However, the value of VDS is affected due to variations in Tj which varies the parameters RP , VTh , and k
  • In region R1: Increase in Tj would increase RP (0.92% / oC), and hence increase in VDS
  • Increase in Tj would decrease VTh (-0.13% / oC) and k (-0.27% / oC)
  • In region R2 and R3: parametric variation in VTh and k may increase or decrease VDS depending upon the operating conditions

Variation in VDS with temperature in different regions of static ID-VDS characteristics at given VGS and ID

Effect of Parameter variation on VDS

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  • VDS,max should be considered for selection of VGS to prevent the false triggering of the desaturation protection
  • VDS,max keeps on increasing at lower VGS and higher ID

For a given value of ID, the VGS should be selected such that the VDS,max is below the Vpro

Nature of VDS,max at varying VGS and ID considering parametric variation due to temperature at 100oC

Effect of Parameter variation on VDS

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Simulation results

  • 350W, 48V i/p to 60V o/p, dc-dc boost converter, MOSFET: IPP60R105CFD7
  • For each loading, VGS is reduced from its recommended gate voltage to the lowest value possible without triggering the desaturation protection

Power loss manipulation range and different constraints on power loss at Tj of (a) 50oC, and (b) 100oC

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Experimental results

  • 350W dc-dc Boost converter developed in laboratory
  • No significant change in power loss when VGS reduced from 15V to 8V

Experimental results for the proposed methodology at

VGS = 8V

Laboratory developed prototype

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Experimental results

  • On identification of fault, the fault pin of driver transitions from logic high level to low level
  • Minimum value of VGS at 350W converter loading such that VDS is less then Vpro
    • Without temperature effect: VGS = 5.5V
    • With temperature effect: VGS = 5.7V

Experimental results for the proposed methodology, (a) VGS = 5.5V, and (b) VGS = 5.7V

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Conclusions

  • On-state VDS of MOSFET is varied by changing VGS to modulate the power losses.
  • For varying load conditions, maximum range of VGS is obtained to maximize the power loss manipulation of PSD without triggering the desaturation protection.
  • For the selected PSD (and for many other commercially available ones), there is no significant change in the power loss for reduction in the VGS from 15V to 8V.
  • The on-state VDS of the PSD depends upon the temperature and its effect should be considered while calculating the lower value of VGS.
  • During experimental validation, it is found that false triggering of desaturation protection occurs when temperature effect is not taken into account.

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THANK YOU

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Methodology of Gate Voltage Selection for Power Loss Manipulation of Power Semiconductor Device - Sandeep Anand