01/17/24 DC-MHS Public Meeting

DC-MHS Project Leads

These meetings are recorded via audio and video. By participating you consent that these recordings may be made publicly available. Any presentation materials, proposals and meeting minutes are published on the respective project's wiki page and are open to the public in accordance with OCP's Bylaws and IP Policy. This can be found at http://opencompute.org/about/ocp-policies/.

Connect. Collaborate. Accelerate.

01/17/24 Public Meeting

• WIKI Updated, M-PnP Workstream added (Brian)
• M-CRPS Workstream Update (Aurelio R.)
• M-HPM Workstream Update (Mike G.)
• M-PnP Workstream Update (Tim L.)
• M-PIC Workstream Update (Cliff D.)
• M-SIF Workstream Update (Greg S.)
• Edge-MHS Update (Dirk)

These meetings are recorded via audio and video. By participating you consent that these recordings may be made publicly available. Any presentation materials, proposals and meeting minutes are published on the respective project's wiki page and are open to the public in accordance with OCP's Bylaws and IP Policy. This can be found at http://opencompute.org/about/ocp-policies/.

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M-CRPS Workstream Update

M-CRPS Base Specification version 1.03 RC2 released!. Please check the revision history table for all the updates, some of them includes:

• Multilevel PSON# signal to support 12V and 54V M-CRPS turn ON and electrical keying mechanism, as well as full power cycle feature that turns OFF both main and standby rails.
• Added a mechanical feature in the 60 mm in width form factor to prevent it from being inserted in a bay that is configured for a 73.5mm in width M-CRPS.
• 3D models and drawings for thermal sleeves for thermal testing.
• And more updates/tweaks.

These meetings are recorded via audio and video. By participating you consent that these recordings may be made publicly available. Any presentation materials, proposals and meeting minutes are published on the respective project's wiki page and are open to the public in accordance with OCP's Bylaws and IP Policy. This can be found at http://opencompute.org/about/ocp-policies/.

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M-CRPS Workstream Update

• 60mm M-CRPS keying

• M-CRPS thermal sleeve and plate

These meetings are recorded via audio and video. By participating you consent that these recordings may be made publicly available. Any presentation materials, proposals and meeting minutes are published on the respective project's wiki page and are open to the public in accordance with OCP's Bylaws and IP Policy. This can be found at http://opencompute.org/about/ocp-policies/.

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M-HPM Workstream Update

• M-SDNO V0.7 Schedule
• Release Candidate 1 Currently in Workgroup Review
• Public Release of Release Candidate 2 Targeted for Monday 1/29/2024
• Updated CAD files will be included in release

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• M-SDNO V0.7 Change Highlights
• Class C details added, including width of 426mm
• Zone 2 (Secondary Side KOZs) updated to incorporate Class C
• Max HPM assembly Z-height increased from 5.86mm to 6.2mm
• Some mounting holes changed from required to recommended
• Added allowance for negative board features
• Changed DC-SCM to a common location for all HPM Classes (Class D Change)
• Various section rewrites to increase clarity of requirements and recommendations

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• M-FLW and M-DNO Update Schedule TBD
• Minor changes identified to keep specifications consistent
• Further information to be provided at next months call

These meetings are recorded via audio and video. By participating you consent that these recordings may be made publicly available. Any presentation materials, proposals and meeting minutes are published on the respective project's wiki page and are open to the public in accordance with OCP's Bylaws and IP Policy. This can be found at http://opencompute.org/about/ocp-policies/.

Connect. Collaborate. Accelerate.

M-HPM Workstream Update

These meetings are recorded via audio and video. By participating you consent that these recordings may be made publicly available. Any presentation materials, proposals and meeting minutes are published on the respective project's wiki page and are open to the public in accordance with OCP's Bylaws and IP Policy. This can be found at http://opencompute.org/about/ocp-policies/.

Updated DC-SCM Location

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M-HPM Workstream Update

These meetings are recorded via audio and video. By participating you consent that these recordings may be made publicly available. Any presentation materials, proposals and meeting minutes are published on the respective project's wiki page and are open to the public in accordance with OCP's Bylaws and IP Policy. This can be found at http://opencompute.org/about/ocp-policies/.

Far Side Recommended Holes

Negative HPM Features

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M-HPM Workstream Update

These meetings are recorded via audio and video. By participating you consent that these recordings may be made publicly available. Any presentation materials, proposals and meeting minutes are published on the respective project's wiki page and are open to the public in accordance with OCP's Bylaws and IP Policy. This can be found at http://opencompute.org/about/ocp-policies/.

Updated Zone 2 Example (Class C Extended Length)

Updated Zone 2 Example (Class D Extended Length)

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M-SDNO V0.7 Zone 2 KOZs was/is

These meetings are recorded via audio and video. By participating you consent that these recordings may be made publicly available. Any presentation materials, proposals and meeting minutes are published on the respective project's wiki page and are open to the public in accordance with OCP's Bylaws and IP Policy. This can be found at http://opencompute.org/about/ocp-policies/.

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M-Plug-n-Play Workstream Update

• Workstream kicked off
• Focused on modular HW interoperability & easing the integration / platform enablement of new DC-MHS compliant HPMs, focusing 1st on HPM programmables:
• FRUs - Common discovery
• FPGA - Common IP cores, APIs & HW design map templates for HPM producer deliverables to ease adoption/ingestion into BMC FW, SCM FPGA, etc.
• Further scope being defined. Does not replace or duplicate other efforts / standards.

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Contact primary DC-MHS group to learn more: https://ocp-all.groups.io/g/OCP-DC-MHS

These meetings are recorded via audio and video. By participating you consent that these recordings may be made publicly available. Any presentation materials, proposals and meeting minutes are published on the respective project's wiki page and are open to the public in accordance with OCP's Bylaws and IP Policy. This can be found at http://opencompute.org/about/ocp-policies/.

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M-PIC Workstream Update

Erratum for M-PIC V1.03

• The FULL_PWR_CYCLE_N pull-up circuit connected to 12V_STBY_PDB (on PDB) is documented as being on the HPM. If implemented on the HPM (to 12V_STBY), it will prevent power up.
• The M-PIC workstream is working on a fix and will publish an update ASAP.

48V Content

• Instead of starting a new 48V workstream and a new specification as previously stated, DC-MHS is now working on 48V content in a copy of v1.03 labeled with “48V Addendum 0.3 ”. It’ll remain separate until the content is ~0.9 and ready to be integrated into the main M-PIC as v1.1x specification.

These meetings are recorded via audio and video. By participating you consent that these recordings may be made publicly available. Any presentation materials, proposals and meeting minutes are published on the respective project's wiki page and are open to the public in accordance with OCP's Bylaws and IP Policy. This can be found at http://opencompute.org/about/ocp-policies/.

Connect. Collaborate. Accelerate.

M-SIF Workstream Update

• Progressing towards v0.7 release

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• Expected updates include:
• Reference power architecture additions
• Default Clocking and Reset topologies
• Node Level Configuration EEPROM and Register Map Definition
• Additional reference connector vendors and pinouts

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These meetings are recorded via audio and video. By participating you consent that these recordings may be made publicly available. Any presentation materials, proposals and meeting minutes are published on the respective project's wiki page and are open to the public in accordance with OCP's Bylaws and IP Policy. This can be found at http://opencompute.org/about/ocp-policies/.

Connect. Collaborate. Accelerate.

Edge-MHS Update

• Edge-MHS workstream establishment discussions continue
• Team has aligned on targeted scope & objectives for effort
• Focus shall be on building blocks for Telco/Edge such as:
• Form Factor, new i-SCM usage, Timing Requirements (driven to TAP), and other value added Edge building blocks
• Next Steps - work with OCP to establish workstream
• Expected timing - Workstream establishment targeted March/April timeframe
• If Edge-MHS established, initial specifications in 2024

These meetings are recorded via audio and video. By participating you consent that these recordings may be made publicly available. Any presentation materials, proposals and meeting minutes are published on the respective project's wiki page and are open to the public in accordance with OCP's Bylaws and IP Policy. This can be found at http://opencompute.org/about/ocp-policies/.

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Backup – Spec Info

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DC-MHS + OCP

DC-MHS Website:

https://www.opencompute.org/projects/dc-mhs

DC-MHS WIKI:

https://www.opencompute.org/wiki/Server/DC-MHS

Training Note

Bottom of WIKI has several useful training videos and presentations that are highly recommended.

Public Email List Subscription

https://ocp-all.groups.io/g/OCP-DC-MHS

Public Meetings

Monthly meetings reoccur 3^rd WED 8am PT monthly. Meeting logistics provided on DC-MHS Home Page Call Calendar. Meeting recordings posted to WIKI.

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*Don’t Overlook

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Mechanics of Collaboration

M-XIO/PESTI

Workstream

Charlie Z. (Dell)

Javier L. (Intel)

Open Compute

DC-MHS Sub-Project

Brian Aspnes (Intel)

Shawn Dube (Dell)

M-PIC

Workstream

Tim L. (Dell)

Cliff D. (Intel)

M-CRPS

Workstream

Jon L. (Dell)

Aurelio R. (Intel)

M-HPM

Workstream

Corey H. (Dell)

Brian A. (Intel)

M-FLW

Specification

Corey H. (Dell)

Brian A. (Intel)

M-SIF

Workstream

Greg S. (AMD)

Dirk B. (Intel)

DC-MHS = Datacenter Modular Hardware System

1. Modular Host Processor Modules (M-HPM)
• Modular FulL Width HPMs (M-FLW)
• Modular DeNsity Optimized HPMs (M-DNO)
• Modular Scalable DeNsity Optimized HPMs (M-SDNO)
2. Modular Platform Infrastructure Connectivity (M-PIC)
3. Modular Common Redundant Power Supply (M-CRPS)
4. Modular eXtensible I/O (M-XIO) + Modular PEripheral Sideband Tunneling Interface (M-PESTI)
5. Modular Shared InFrastructure (M-SIF)
6. Modular Plug and Play (M-PnP)

M-DNO

Specification

Mike G. (Dell)

Dirk B. (Intel)

M-SDNO

Specification

Mike G. (Dell)

Brian A. (Intel)

Andy J. (AMD)

M-PnP

Workstream

Tim L. (Dell)

Phil L. (HPE)

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Activities and Timeline

DC-MHS Base Specification Introduction

• Form-Factor Base Specifications details include mechanical outlines, mount-points, placement restrictions, entry/exit point electrical requirements, and connector placements. Each form-factor Base Specification may include multiple, related form-factors with a high degree of consistency between them, maximizing design reuse.
• Read these first, you can choose DNO,SDNO, or FLW if you only have one application

• Ingredient Base Specifications define the interfaces from the HPM to other classes of peripheral and infrastructure within a chassis, including but not limited to connector, pin-out, electrical, signaling, sequencing, and protocol requirements.
• The HPM form-factor Base Specifications draw upon these Ingredient Base Specifications for consistency across all DC-MHS Rev 1.0 HPMs.
• Read M-XIO, M-PIC and M-SIF second
• Read M-CRPS and M-PESTI third, after you comprehend the other four Base Specs

Form-Factor

Ingredient

Partner Specifications

LPTI r2.1

LVDS Tunneling Protocol & Interface

NIC r3

Network Interface Card

• Partner Specifications are used by DC-MHS and must be understood as they are used as core specifications in DC-MHS. Must be a member of PCISIG to view new/unreleased specs.
• Read these last , after you comprehend all for the DC-MHS Base Specs

M-XIO

PCIe/CXL Connectivity to Peripherals

M-PIC

Platform Infrastructure Connectivity

M-PESTI

Sideband Signal Virtualization

M-CRPS

AC/DC and DC/DC 12v/48v Supplies

M-FLW

Full Width Host Processor Module

M-DNO/M-SDNO

Density Optimized Host Processor Module

DC-SCM r2.1

Secure Control Module

PCISIG Base/CEM/Internal Cable Specs

PCI Express 6.0

Open Rack v3

OCP Open Rack

M-SIF

Shared Infrastructure

Specification Links

• OCP DC-MHS r1 Specifications (CRPS, DNO, FLW, PESTI, PIC, SIF, XIO)
• https://www.opencompute.org/wiki/Server/DC-MHS
• OCP DC-SCM r2 and LPTI r2 Specifications
• https://www.opencompute.org/wiki/Hardware_Management/Hardware_Management_Module
• v2.1 was released 5/23/23
• OCP NIC r3 Specification
• https://www.opencompute.org/wiki/Server/NIC
• v1.21 was released on 12/22/22
• OCP Open Rack r3 Specification
• https://www.opencompute.org/wiki/Open_Rack/SpecsAndDesigns
• v1.0 was release 9/22/22
• PCISIG Internal Cable, Base and CEM Specifications
• https://pcisig.com/specifications
• Must be a member to see unreleased specifications
• New unreleased v6.x Base Spec w/ new Chapter 12 called “Out of Band Management” (Protocol WG)
• https://members.pcisig.com/wg/PCIe-Protocol/document/19507
• New unreleased v1.0 Internal Cable Specification (Electrical WG)
• https://members.pcisig.com/wg/PCIe-Electrical/document/19757
• New unreleased v6.0 CEM spec with USB2 via JTAG (Mechanical WG)
• https://members.pcisig.com/wg/PCIe-Mechanical/document/19700
• https://members.pcisig.com/wg/PCIe-Mechanical/document/folder/1099

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