ELECTROLESS COPPER DEPOSITION
ON LOW TEMPERATURE
SILVER THICK FILMS
Bogdan Mihăilescu1), Marin Gheorghe2), Gaudențiu Vărzaru3), Mihai Brânzei4), Ciprian Ionescu1), Simona Gheorghe2), Răzvan Ungurelu3), and Paul Mugur Svasta1)
1) Center for Electronic Technology and Interconnection Techniques (CETTI), Electronics and Telecommunications Faculty, University POLITEHNICA of Bucharest, Romania
2) NANOM - MEMS, Râșnov, Romania
3) Syswin Solutions, Bucharest, Romania
4) Research and Expertise Center for Special Materials (CEMS), �University POLITEHNICA of Bucharest, Romania
8th International Conference on Materials Science and Technologies – RoMat November 26-27th, 2020, Bucharest, Romania
ACKNOWLEDGMENT
This work was supported by the grant of the Romanian National Authority for Scientific Research and Innovation, CCCDI - UEFISCDI, project number 153/2020, ERANET-MANUNET-III-COMPACT, within PNCDI III.