09/20/23 DC-MHS Public Meeting

DC-MHS Project Leads

These meetings are recorded via audio and video. By participating you consent that these recordings may be made publicly available. Any presentation materials, proposals and meeting minutes are published on the respective project's wiki page and are open to the public in accordance with OCP's Bylaws and IP Policy. This can be found at http://opencompute.org/about/ocp-policies/.

Connect. Collaborate. Accelerate.

09/20/23 Public Meeting

• M-CRPS v1.02 Workstream Update (Aurelio R.)
• M-SDNO v0.5 Workstream Update (Mike G.)
• M-SIF v0.5 Workstream Update (Greg S.)
• M-PIC v1.03 Workstream Update (Cliff)
• Global Summit (Brian)
• MHS Presentations
• MHS Experience Center Demos
• MHS Expo Hall Lightning Talks

These meetings are recorded via audio and video. By participating you consent that these recordings may be made publicly available. Any presentation materials, proposals and meeting minutes are published on the respective project's wiki page and are open to the public in accordance with OCP's Bylaws and IP Policy. This can be found at http://opencompute.org/about/ocp-policies/.

Connect. Collaborate. Accelerate.

M-CRPS Workstream Update

• M-CRPS Base Specification v1.02 has been released on August 23rd 2023.
• M-CRPS Base Specification v1.02 RC2 PDF with bookmarks.
• New set of Mechanical drawings.
• New Set of 3D STP models.
• Working on the Design Specifications.
• 3200W 185mm by 73.5mm M-CRPS is currently under final review, after we release this specification we will move forwards with other design specifications.

These meetings are recorded via audio and video. By participating you consent that these recordings may be made publicly available. Any presentation materials, proposals and meeting minutes are published on the respective project's wiki page and are open to the public in accordance with OCP's Bylaws and IP Policy. This can be found at http://opencompute.org/about/ocp-policies/.

Connect. Collaborate. Accelerate.

M-CRPS Workstream Update

• Summary of changes/additions to M-CRPS v1.02 RC2:
• Added DSSI ping command.
• Added SetA1AsPresenceDetect (similar to simple present in M-PESTI).
• Added Use1BitPMBusAddressing.
• Added DisableRemoteSense option.
• Added status bit for FW upload to indicate a wrong value in the config. file.
• Changed the altitude from 900m to 950m.
• Updated timing requirements.
• Updated component de-rating for electrolytic capacitors.
• Updated life requirements.
• Updated mechanical drawings.
• Updated transient load requirements.

These meetings are recorded via audio and video. By participating you consent that these recordings may be made publicly available. Any presentation materials, proposals and meeting minutes are published on the respective project's wiki page and are open to the public in accordance with OCP's Bylaws and IP Policy. This can be found at http://opencompute.org/about/ocp-policies/.

Connect. Collaborate. Accelerate.

M-HPM Workstream Update (M-SDNO Framework)

These meetings are recorded via audio and video. By participating you consent that these recordings may be made publicly available. Any presentation materials, proposals and meeting minutes are published on the respective project's wiki page and are open to the public in accordance with OCP's Bylaws and IP Policy. This can be found at http://opencompute.org/about/ocp-policies/.

HPM Class Compatibility Goals

•Specification

• Defines HPM Class A, B, C, D

• Class ‘X’ HPMs all have consistent feature set, variable length

• Defines Minimum and maximum lengths for each class

• Provides Common chassis intervals (for each class if necessary)

•System Designers

• Develop chassis that support HPM class(es) up to a maximum length, i.e.

• Chassis 1: Supports Class A, Class B up to 305mm

• Chassis 2: Supports Class A, Class B and Class D up to Max mm

• Work with HPM partners to communicate implications of various lengths

​

•HPM Designers

• Select the appropriate HPM class for their design

• Are driven to design to the smallest L they can for maximum chassis compatibility

​

•0.5 M – “Scaleable” DNO Draft

•Plan to have release candidate for workgroup by end of this week

•Target public release by 10/1

•Supercedes “Directional” 0.3 document including Types 5, 6 and 7

​

Connect. Collaborate. Accelerate.

PERST_N [3:0]

REFCLK_P/N [3:0]

​

​

​

​

Core

Element

Sled

Redundant Mgmnt Interface(s)

Power Interface

Data

Slice 0

Interface

Data

Slice n

Interface

Data

Slice

Interface(s)

x16 PCIe/CXL lanes

HPM Far Edge

HPM Near Edge

Redundant

Management Interface

2x PESTI

2x KX_KR_TX_P/N or USB 3.0**

2-WIRE (I2C/I3C)

2x MNGT_CBL_PRSNT_N

Data Slice Bifurcation & Directionality is negotiated over the management interfaces.

2x KX_KR_RX_P/N or USB 3.0**

2x USB_D+/D-

FORCE_THROTTLE_N

…

4x 2-WIRE (I2C/I3C)

CBL_PRSNT_N [3:0]

M-SIF Workstream Update

4x FLEXIO*

8x RFU*

8x FLEXIO*

These meetings are recorded via audio and video. By participating you consent that these recordings may be made publicly available. Any presentation materials, proposals and meeting minutes are published on the respective project's wiki page and are open to the public in accordance with OCP's Bylaws and IP Policy. This can be found at http://opencompute.org/about/ocp-policies/.

* The number of available FLEXIO and/or RFU may vary depending on I/O connector choice.

​

** KX/KR or USB 3.0 will need to be negotiated between the host and chassis manager prior to enablement of this link.

• Specification v.0.5 has been completed and is out for review…YAY!
• Significant updates to:
• High-speed IO signal list and definitions
• Management signal list, definitions and bussing options
• Appendix containing physical connector interface details
• Spec posting to wiki by EoD 9/29/2023

• SEE YOU ALL AT GLOBAL SUMMIT ‘23 !!!

Connect. Collaborate. Accelerate.

[Public]

M-PIC Workstream Update

• V1.03 is planned before the OCP Global Summit.
• Key Changes:
• PDB Management connector pinout: last RSVD to Full Power Cycle Request
• Cable Optimized Boot Storage:
• Updated the 12V signal specification from 25W to 48W
• Added an option to control power with PWRDIS instead of gating on HPM
• E1.S direct attach boot storage updated to include I3C support
• Updated Flex I/O sideband signal topologies from 127k to 100k 𝝮 pull up for improved signal margin.
• Clarified 12V primary as a ramp-controlled rail
• Clarified Compliance requirements in Section 3
• Added contributor(s)

These meetings are recorded via audio and video. By participating you consent that these recordings may be made publicly available. Any presentation materials, proposals and meeting minutes are published on the respective project's wiki page and are open to the public in accordance with OCP's Bylaws and IP Policy. This can be found at http://opencompute.org/about/ocp-policies/.

Connect. Collaborate. Accelerate.

Global Summit Update

These meetings are recorded via audio and video. By participating you consent that these recordings may be made publicly available. Any presentation materials, proposals and meeting minutes are published on the respective project's wiki page and are open to the public in accordance with OCP's Bylaws and IP Policy. This can be found at http://opencompute.org/about/ocp-policies/.

Presentations

Experience Center

Expo Hall Lightning Talk

​

Connect. Collaborate. Accelerate.

Backup – Spec Info

Connect. Collaborate. Accelerate.

DC-MHS + OCP

DC-MHS Website:

https://www.opencompute.org/projects/dc-mhs

DC-MHS WIKI:

https://www.opencompute.org/wiki/Server/DC-MHS

Training Note

Bottom of WIKI has several useful training videos and presentations that are highly recommended.

Public Email List Subscription

https://ocp-all.groups.io/g/OCP-DC-MHS

Public Meetings

Monthly meetings reoccur 3^rd WED 8am PT monthly. Meeting logistics provided on DC-MHS Home Page Call Calendar. Meeting recordings posted to WIKI.

​

*Don’t Overlook

These meetings are recorded via audio and video. By participating you consent that these recordings may be made publicly available. Any presentation materials, proposals and meeting minutes are published on the respective project's wiki page and are open to the public in accordance with OCP's Bylaws and IP Policy. This can be found at http://opencompute.org/about/ocp-policies/.

Connect. Collaborate. Accelerate.

Activities and Timeline

DC-MHS Base Specification Introduction

• Form-Factor Base Specifications details include mechanical outlines, mount-points, placement restrictions, entry/exit point electrical requirements, and connector placements. Each form-factor Base Specification may include multiple, related form-factors with a high degree of consistency between them, maximizing design reuse.
• Read these first, you can choose DNO or FLW if you only have one application

• Ingredient Base Specifications define the interfaces from the HPM to other classes of peripheral and infrastructure within a chassis, including but not limited to connector, pin-out, electrical, signaling, sequencing, and protocol requirements.
• The HPM form-factor Base Specifications draw upon these Ingredient Base Specifications for consistency across all DC-MHS Rev 1.0 HPMs.
• Read M-XIO, M-PIC and M-SIF second
• Read M-CRPS and M-PESTI third, after you comprehend the other four Base Specs

Form-Factor

Ingredient

Partner Specifications

LPTI r2.1

LVDS Tunneling Protocol & Interface

NIC r3

Network Interface Card

• Partner Specifications are used by DC-MHS and must be understood as they are used as core specifications in DC-MHS. Must be a member of PCISIG to view new/unreleased specs.
• Read these last , after you comprehend all for the DC-MHS Base Specs

M-XIO

PCIe/CXL Connectivity to Peripherals

M-PIC

Platform Infrastructure Connectivity

M-PESTI

Sideband Signal Virtualization

M-CRPS

AC/DC and DC/DC 12v/48v Supplies

M-FLW

Full Width Host Processor Module

M-DNO

Density Optimized Host Processor Module

DC-SCM r2.1

Secure Control Module

PCISIG Base/CEM/Internal Cable Specs

PCI Express 6.0

Open Rack v3

OCP Open Rack

M-SIF

Shared Infrastructure

Specification Links

• OCP DC-MHS r1 Specifications (CRPS, DNO, FLW, PESTI, PIC, SIF, XIO)
• https://www.opencompute.org/wiki/Server/DC-MHS
• OCP DC-SCM r2 and LPTI r2 Specifications
• https://www.opencompute.org/wiki/Hardware_Management/Hardware_Management_Module
• v2.1 was released 5/23/23
• OCP NIC r3 Specification
• https://www.opencompute.org/wiki/Server/NIC
• v1.21 was released on 12/22/22
• OCP Open Rack r3 Specification
• https://www.opencompute.org/wiki/Open_Rack/SpecsAndDesigns
• v1.0 was release 9/22/22
• PCISIG Internal Cable, Base and CEM Specifications
• https://pcisig.com/specifications
• Must be a member to see unreleased specifications
• New unreleased v6.x Base Spec w/ new Chapter 12 called “Out of Band Management” (Protocol WG)
• https://members.pcisig.com/wg/PCIe-Protocol/document/19507
• New unreleased v1.0 Internal Cable Specification (Electrical WG)
• https://members.pcisig.com/wg/PCIe-Electrical/document/19757
• New unreleased v6.0 CEM spec with USB2 via JTAG (Mechanical WG)
• https://members.pcisig.com/wg/PCIe-Mechanical/document/19700
• https://members.pcisig.com/wg/PCIe-Mechanical/document/folder/1099

​