OCP NIC Community Update�April 2025

for server project

�����Sub-group Project wiki: https://www.opencompute.org/wiki/Server/NIC�

Mailing List: https://ocp-all.groups.io/g/OCP-NIC

Agenda

• Version 1.6.0 posted
• SFF-TA-1002 current excursion case study (TE)
• Thermal Workstream update
• Signal Integrity update
• Thermal Test Fixture Update
• OCP NIC management profile

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Electrical Spec Updates

• Version 1.6.0 released to the Wiki page.
• https://www.opencompute.org/w/index.php?title=Server/NIC#Released_Specification_Docs
• Presenting in the OCP Steering Committee Thursday April 3rd, 2025. Pending SC rep voting completion and OCP foundation publication
• Thank you for all of the community help!

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SFF-TA-1002 current excursion case study (TE)

• TE/Matthew Ho presented their current excursion study with SFF-TA-1002 in lab setup
• TE to review the results vs SFF-TA-1002 excursion draft spec

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Thermal Workstream

• Nvidia helped to update TSFF thermal analysis.
• We now have the data to update the spec

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• 1U height option shows benefits especially in hot aisle case
• Need input from system vendors regarding 1U height OCP NIC
• Plan to discuss in DC-MHS HPM meeting

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DSFF SI Update

• Dell contributing DSFF CBB SI fixture, Gen 6 by default
• Initial protos arrived in Nov 2024
• Several issues found, addressed in next revision
• Next prototype arrived 3/15
• Schematic & Board files here: Link
• Broadcom, Dell, Intel to report test results

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• For DSFF CLB use two of CLB SFFs

DSFF Thermal Test Fixture Overview

• New DSFF TTF will support SFF / TSFF / DSFF form factors at PCIe^® speeds up to Gen 7

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• Metal housing with a PCB designed to extend PCIe lanes from a DC-MHS compatible server to a mounted OCP 3.0 DUT card

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• Intended to attach to a wind tunnel or flow bench

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• Pre-defined sensor locations for test repeatability

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• Onboard MCU shall operate same as prior thermal test fixtures and codebase will be uploaded to the Github repository

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• Schematic & ECAD complete, uploaded to the OCP NIC Cloud

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• Assembly units arriving within days

DSFF Thermal Test Fixture

DSFF TTF Airflow Operation

Please note: PCIE^® design mark is a registered

trademark and/or service mark of PCI-SIG.

OCP NIC management profile

• OCP Hardware Management workstream is seeking feedback about OCP NIC Management Redfish profile
• https://github.com/opencomputeproject/HWMgmt-OCP-Profiles/blob/master/EthernetNIC/OCP-NIC-Profile.md
• Presented by Jeff Autor, Jeff Hilland, John Leung

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Thank You

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