SERVER
OCP NIC Community Update�May 2023
For Server Project�����Sub-group Project wiki: https://www.opencompute.org/wiki/Server/NIC�
Mailing List: https://ocp-all.groups.io/g/OCP-NIC
NIC3.0
Agenda
TSFF Thermal Test Fixture: Background
New TSFF test fixture
TSFF Airflow Distribution Issue
NVIDIA performed tests with the new test fixture and encountered an issue related to airflow distribution.
Due to the geometry of the test chamber and front panel perforation, a fraction of the air leaks to the sides of the test fixture but exit through the bracket area. This airflow is not typical for servers where if the leakages occurs – the air pass through the other holes in the front panel of the server
The purpose of this work is:
TSFF Thermal Test fixture: Side holes solution
Holes were added at the sides of the test chamber to allow the leaked airflow to flow to the sides.
Geometry 2 inside the proposed TSFF test fixture
OCP NIC SI Test Fixtures
CLB 5.0 32GT/s status:
CBB 5.0 32GT/s status:
OCP NIC 3.0 SFF CLB 5.0 prototype
Calibration
CLB board 1
Impedance Coupon
CLB board 2
Jason
OCP NIC 3.0 SFF CBB 5.0 block diagram
iPASSLabs OCP NIC test partner & SI fixtures
Gather feedback throughout the year
Provide your feedback at:�https://tinyurl.com/feedback2ocpnic