ODSA Chiplet Usage Survey
The Open Domain-Specific Architecture (ODSA) Working Group is organized as part of the Open Compute Project (OCP) to develop standards for the development of multi-vendor system-in-package solutions based on chiplet technology.

“Chiplets” are silicon devices offerings at the known-good-die level that are indented to to be combined with other chiplets, potentially from multiple providers, with standardized interfaces assembled into a System in a Package (SIP) device. SIP type devices may also be referred to as Multi-Chip Modules (MCMs) or 2.5D/3D devices.

This survey intends to gather your input as a technology provider or potential participant in the upcoming emerging chiplet market and the business aspects of chiplet technology.

If chiplets are available in the market place, they can be used for building system-in-package (SIP) type devices by any design and manufacturing entity with MCM, 2.5D or 3D packaging technology. Such a market for chiplets has the potential for new business channels for chip makers as well as system makers.

Please let us know your thoughts on the following questions:

Email address *
1. Do you (or your company) design/ship any system-in-package (SIP) type devices such as multi-die packages, MCMs, Modules, etc.? *
2. Would you (or your company) be a producer of chiplets or related IP for usage in SIPs?
3. Would you (or your company) be a consumer/user of SIP technology?
SIP Market Overview Questions
4. SIP devices will be developed by SIP users (for example developers of data center offload devices, wireless base stations or mobile devices)
5. SIP technology makes more sense in high performance (data center) than high volume (mobile phone) applications
6. SIP integration will be performed as a service by foundry semiconductor providers such as TSMC, Global Foundries, etc.
7. SIP integration (manufacturing) will be provided as a service by packaging providers such as ASE, Amkor, etc.
8. SIP technology will be primarily driven by a few applications where space is at a premium
9. SIP technology will create a new industry of chiplet designers, specializing in chiplet offerings like SerDes, memory, etc.
10. Inventory and supply chain planning of chiplet die will be managed by what kinds of companies? Foundries, Packaging houses, IDMs?
SIP Technology Drivers
11. SIP technology will result in reduced system cost.
12. SIP technology will result in reduced system power.
13. The high cost of advanced technology nodes (14/16 nm, 7/10 nm) will create new opportunities for SIP technology.
14. The availability of FPGA chiplet technology will be essential to the success of SIP technology.
15. General purpose multicore CPUs, like Arm, x86 or RISC-V, available as chiplet technology will be essential to the success of SIP technology.
16. SIP technology is needed to keep up with growing performance demands in cloud-scale data centers.
SIP Technology Adoption Blockers
17. SIP devices require standard interfaces between chiplets to be successful.
18. SIP standards for memory chip (DRAM/SRAM/NVM) technologies need to be developed.
19. SIP technology will carry a price premium when compared to discretely packaged devices.
20. SIP integrated devices will be only available from a few major semiconductor providers.
21. SIP technology will suffer from standards battles that will delay its adoption.
Supply Chain Considerations
22. SIP technology adoption will have problems with margin stacking causing higher prices.
23. Design services firms will be essential to the success of SIP technology.
24. Standards for die testing and KGD quality need to be included as part of standards for SIP technology.
25. Standards for on-die diagnosis tests and coverages for chiplets will need to be developed.
26. Standards for fault coverage for chiplets will need to be developed.
27. Is there a role for distributors (Arrow, Avnet, etc.) to play in inventory and supply management? If so, what?
28. Is there anything else you'd like to share about your views on a chiplet marketplace?
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