“Chiplets” are silicon devices offerings at the known-good-die level that are indented to to be combined with other chiplets, potentially from multiple providers, with standardized interfaces assembled into a System in a Package (SIP) device. SIP type devices may also be referred to as Multi-Chip Modules (MCMs) or 2.5D/3D devices.
This survey intends to gather your input as a technology provider or potential participant in the upcoming emerging chiplet market and the business aspects of chiplet technology.
If chiplets are available in the market place, they can be used for building system-in-package (SIP) type devices by any design and manufacturing entity with MCM, 2.5D or 3D packaging technology. Such a market for chiplets has the potential for new business channels for chip makers as well as system makers.
Please let us know your thoughts on the following questions: