Registration for Advanced Semiconductor Packaging Workshops (Jan

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Registration for Advanced Semiconductor Packaging Workshops (Jan - Feb 2026)

Venue: Newcastle Australia Institute of Higher Education Singapore 230 Victoria Street, #04-09/10, Bugis Junction Towers, Singapore 188024

Registration fee: SGD 800 per workshop (for registrations before 15 Dec) and SGD 1,000 per workshop (after 15 Dec).
Please request a quotation by emailing admin@launchxtec or proceed with payment via PayNow. If you are registering three or more participants from your organization (in any combination), please email admin@launchxtec.com to receive a discount.

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Workshop registerd

Chiplet & Heterogeneous Integration for Advanced Packaging (8-9 Jan 2026)

Flip Chip, Thermocompression, and Hybrid Bonding (22-23 Jan 2026)

Glass Core Substrates for Advanced Packaging (5-6 Feb 2026)

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