Sponsorship Form - SEG Seismic Processing Working Workshop
This form is the application for a sponsorship to attend the SEG 3D Seismic Processing Working Workshop - Land 2015. The workshop will take place in Houston, TX, on August 19-22, 2014. More information is at
http://www.ahay.org/wiki/SEG_3D_Seismic_Processing_Working_Workshop_Houston_2015-_Land_3D

To receive a travel sponsorship you must also apply to attend the workshop. To avoid duplicating questions, information from the workshop application form will be used along with information in this form to award the sponsorships. Before completing this form, I recommend you first complete the workshop application form at: https://docs.google.com/forms/d/1yn_PnYgZlXwsNwKe-1HVHzqEFOW4-TYpHbggmg91HSI/viewform?usp=send_form

The travel sponsorship reimburses expenses including airfare, local transportation, lodging, and meals to attend the 4 day workshop. Travel may be US or international. Recipients may be individuals or two person teams. We intend to sponsor three workshop participants based on the merit of the proposals made in this form. Application deadline for sponsorship is June 15.
Team member 1: first and last name *
Your answer
Team member 1: email address *
Your answer
Team member 2: first and last name
Leave blank for a individual sponsorship.
Your answer
Team member 2: email address
Leave blank for an individual sponsorship.
Your answer
What processing have you applied to the Teapot Dome 3D data? *
Your answer
What do you plan to do at the working workshop with the Teapot Dome 3D data? *
Your answer
What software do you plan to use? *
Your answer
What other information would you like us to consider?
Your answer
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