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As you cool down a silicon wafer, it becomes a better thermal conductor. However, at some point the trend reverses.
Which properties governed these two trends and why?
Which aspects of thermal transport are we treating classically and which require quantum mechanics?
For transport across an interface layer (say a thin film), the thickness can be shorter than the phonon mean free path. In that case, we describe transport as ballistic, rather than diffusive.
Do you expect Fourier's law to still hold?
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