Request edit access
JavaScript isn't enabled in your browser, so this file can't be opened. Enable and reload.
EML PhotoLithography Record (no confidential info, pls)
Please Record All Known Info (may type unknown...)
Staff will modify filed responses, if requested
Sign in to Google
to save your progress.
Learn more
* Indicates required question
name
*
short nickname ok
Your answer
Type, size and thickness of substrate
*
(ie glass 1x3" slides, or 1 cm-2 Si)
Your answer
Room Humidity
lower than 35% needs longer exposures, higher than 50% can have sticking and adhesion failures
Your answer
mask type
*
glass/ chrome
glass/ transparency
Other:
application for resist
*
what is the Lithography's purpose?
wet etch patterning
liftoff pattern
casting mold, ie microfluidic
plasma patterning (ashing or RIE)
Other:
HMDS
*
none
spin on, coater
vapor phase, dessicator
Sample Preparation
ie acetone/IPA on spinner, O2 Plasma or acid clean
Your answer
smallest mask feature size (um)
Your answer
smallest achieved feature size (um)
Your answer
type of Resist (brand & thickness)
*
(ie SU8 2050 or SPR700)
Negative Epoxy Resists (SU8*-*)
Positive Resin Resists (OCG/AZ4620)
Negative Resin Resists (NR7*.*)
AZ 5214 Image Reverse
Other:
spin parameters
*
sec, RPM
Your answer
softbake parameters (min, C)
*
hotplate or convection oven, temperature, time)
Your answer
More than one layer
assume single coats, unless list # for more thickness
std, single coat
double coat/ bake
Other:
Clear selection
contact mode
*
soft contact
hard contact
vacuum contact
Other:
resist thickness um:Targeted & Measured?
*
Your answer
Next
Clear form
Never submit passwords through Google Forms.
This content is neither created nor endorsed by Google. -
Terms of Service
-
Privacy Policy
Does this form look suspicious?
Report
Forms
Help and feedback
Contact form owner
Help Forms improve
Report
