DISCO Wafersaw

DISCO Wafer Saw - DAD3240 - Capable of cutting silicon, glass, quartz, and Sapphire substrates up to 8" circles. Belongs to the flexible / contaminated group of equipment.

Picture and Location

Background

Process Capabilities

Cleanliness Standard: Flexible/ Contaminated

Performance of the Tool:

Blade Schedule:

Contact List and How to Become a User

Contact List

Training to Become a Tool User

Off Hour room access code: 5314

DISCO DAD3240 Operation

Short Procedure (Cut Chart Menu)

Device Data Set Up

Operating Procedure (Layer Menu)

Process Monitoring and Machine Qualification

Tool Qualification Run

Machine Status States

Process Monitoring Results

Picture and Location

 

DAD3420.JPG 

 The DISCO DAD3240 wafer dicing saw is located in the utility room across from the SNF stockroom.  Access to this utility room is limited to staff and qualified labmembers.

Background

 

Process Capabilities

Cleanliness Standard: Flexible/ Contaminated

Performance of the Tool:

What the Tool CAN do

Blade Schedule:

What the Tool CANNOT do

Process Monitoring

 

Contact List and How to Become a User

Contact List

The following people make up the Tool Quality Circle:

Training to Become a Tool User

Off Hour room access code: 5314

DISCO DAD3240 Operation

Wafer Preparation:

Short Procedure (Cut Chart Menu)

Equipment Setup:

Figure A 

 Figure B

Cut Wafer:

Process Termination:

 

 Device Data Set Up

Figure I.jpg

 

Figure II.jpg

 Figure III.jpg

Table I:  Description of Variable in Device Data

Field Name

Description

ID

Device data ID - 30 characters maximum

Round/ Square

Work piece (wafer) shape - round or rectangle

For round substrates, specify wafer diameter

For square /rectangular substrates, specify x (channel 1) and Y (channel 2) dimensions

Work Thickness

Thickness of work piece/ substrate/ wafer

Tape thickness

Thickness of the tape underneath the work piece

Cutting Channel

Direction of cut.  For example, to make rectanglular dies, the cut has to be in 2 directions (x and y) that are at 90 degree angles from one another

q Angle

Rotation angle of each channel relative to initial position

Cut mode

A- Down cut; Cutting while chuck table is moving from right to left

A_UP - Up cut; cutting while chuck table is moving from left to right

B - Repition of A and A_up cuts

B-ZKEEP - Identical to B without Z-direction escape during indexing

Cut Direction

Rear - from front to rear of the work piece

Front - From rear to front of work piece

Cut Line

No of lines to be cut;.

"0" - will calculate the number of lines that needed to be cut based on the work piece size, index value and specified exclusions

Align

Cutting is performed at the position shifted by the entered distance from the street adjusted position

Noncut F

Distance to be left uncut in the front

Noncut R

Distance to be left uncut in the rear

Offset-l

X-Axis Offset in the funcion select screen (F4) should be yes.  - Offset between chuck table center and work piece; work piece center to the right of chuck table center is a positive offset.

Offset-q

Applicable only if the cut start position has to be offset as cut progresses

Spindle speed

Spindle revoluion - 6000-60000 rpm; Typical for Si work piece: 30,000rpm; for glass substrtes ~20,000 rpm

Precut Process

Precut process to be used

Cutting Ch. Seq

Sequence in which cuts will be made along different channels; 1234, 4321; 12, 21, etc.

Change Unit

Toggles measurements between mm or inch scale.

Sequence

Sequence of cuts for each channel; each sequence can have a different index, blade height and feed rate

Blade height

Distance between the chucktable ad blade tip; Corresponds to thethickness left uncut; should not enter any number below 50um (0.05mm)

Feed speed

Speed at which chuck table moves; mm/sec

Index

Distance between cuts in the same direction.

Depth Steps

For multi-level cutting; each time, the blade enters the work piece to a specified depth (cut depth).  Cuts are reeated until the blade height limit is reached.

Repeat lines

Related to no of repeats for each sequence before the next sequence (refer to Figure IV).

 

Blade & Other recommended settings:

 

Recommended blade, tape and settings (Device data) for the following parameters:

Note:  for all wafer/ substrate types:  Blade Height should be >0.05mm (50um)

1.        Si wafer  ~ 0.5-0.675mm thick –

a.       K & S Hub blade in stock (0.8mm exposure)

b.      80-100um kerf

c.       Tape: Blue tape

d.      Spindle speed – 30,000 rpm

e.      Feed rate: 5mm-20mm

2.       Glass wafers – 0.5mm – 1mm thick

a.       ADT resin blade in stock- ~3mm exposure

b.       kerf -250-300um

c.      Tape – UV tape recommended (150-170um); blue tape is acceptable, but, pieces may not stick very well.  Use caution when using blue tape.

d.       Spindle speed – 20,000rpm

e.      Feed rate = 2-5 mm/sec

f.      For substrates >1mm thick, do 2 pass cut.

3.       Quartz wafers – 0.5mm – 1mm thick

a.       ADT resin blade in stock- ~3mm exposure; kerf - 250-300um

b.      Tape – UV tape recommended (150-170um); blue tape is acceptable, but, pieces may not stick very well.  Use caution when using blue tape.

c.       Spindle speed – 20,000rpm

d.      Feed rate = 0.5-2 mm/sec

e.      For substrates >1mm thick, do 2 pass cut.

4.       Bonded wafers (Si and glass) – 0.5mm – 1mm thick

a.       ADT resin blade in stock- ~3mm exposure; kerf -250-300um

b.      Tape – UV tape recommended (150-170um); blue tape is acceptable, but, pieces may not stick very well.  Use caution when using blue tape.

c.       Spindle speed – 30,000rpm

d.      Feed rate = 2-5 mm/sec

e.      For substrates >1mm thick, do 2 pass cut.

 

Operating Procedure (Layer Menu)

Equipment Set Up:

 

 

Figure 1

Figure 2

Figure 3

 

Figure 4

 

Figure 5a

Figure 5b

 

Figure 6

 

Figure 7 

Cut Wafer:

 

 

Figure 8 

Figure 9

Figures 9a & 9b

 

 Figure 10a

 Figure 10b

 

Figure 11

 

Process Termination:

 

 

 

 

Process Monitoring and Machine Qualification

Tool Qualification Run

 

Frequency

 

Procedure

 

Responsibility

 

 

Recommendation to users with critical processes

 

Machine Status States

Red:

Yellow:

Green:

 

Process Monitoring Results