Lesker Operation Manual

Lesker is a load locked single wafer metal sputter providing flexible processing options for non-CMOS compatible materials. The eight gun magnetron Lesker is classified as gold contaminated and provides non-directional thin film (< 1 um)

Contents

  1. Picture and Location
  2. Background
  3. Process Capabilities
  1. Cleanliness Standard: Flexible/Contaminated
  2. Performance of the Tool
  1. Contact List and How to Become a User
  1. Contact List
  2. Training to Become a Tool User
  1. Operating Procedures
  2. Process Monitoring and Machine Qualification
  1. Tool Qualification Run
  2. Machine Status States
  1. Target requests
  2. Precious Metal Sign out

Picture and Location

 

Lesker Sputter

 

The Lesker Sputter is located in nSiL at Paul Allen Building Room 155A.

 

Background

 

Lesker Sputter joined nSiL in January 2016.  

 

Process Capabilities

Cleanliness Standard: Flexible/Contaminated

The Lesker sputter is in the GOLD contaminated equipment group.  Substrates can come from any piece of equipment in the CLEAN, SEMICLEAN, or GOLD groups.  Most vacuum-compatible materials are allowed in this system.  Photo-resist is acceptable on wafers as long as it has been hard baked. Kapton tape is allowed for holding smaller samples to holder-wafers but should not be exposed to the sputter etch or elevated temperatures. Sodium and potassium-containing glasses are allowed. Most semiconductor materials, and high-vacuum compatible plastics are also acceptable. After deposition of ANY material in the Lesker (including aluminum), substrates are considered contaminated with gold and non-standard metals and can only go into other GOLD contaminated equipment.

 

Performance of the Tool

What the Tool CAN do

            The most current targets and locations are listed in Badger and on tool logbook.

 

What the Tool CANNOT do

Attached pieces thicker than 0.5 inch.

 

Contact List and How to Become a User

Contact List

The following people make up the Tool Quality Circle:

 

Training to Become a Tool User

Operating Procedures

 

Proper attire when using the tool includes:

 

Operating Procedure:

  1. Enable the Lesker Sputter on Badger (found under the nSiL tab on Badger)
  2. Run LL Vent from the touch screen:.
  1. This process should take around 5 minutes.
  2. Recipe End will appear in recipe box once vent is complete.
  1. Load wafer/sample face down into Wafer Carrier.
  2. Align notch in Wafer Carrier with notch in the LL chamber.  
  3. Run LL Pump.
  1. This process should take around 5 minutes.
  2. Recipe End will appear in recipe box once vent is complete
  1. Run Sample Load and wait for Recipe End.
  2. Run desired recipe.
  1. On the touch screen, select Run Recipe.
  1. Choose recipe.
  1. From the dropdown menu, select a Master Recipe with your desire Source # (target #). Make sure the recipe is downstream control.
  1. Change desired recipe parameters.
  1. Type in numbers via the keyboard.
  1. Press Continue Load when done.
  1. The recipe will now run. Make sure the viewing/light shutters are closed during deposition.
  2. Monitor and log recipe parameters.
  3. Recipe End will appear in recipe box once recipe is complete
  1. Run Sample Unload. Recipe End will appear in recipe box once unload is complete.
  2. Run LL Vent.
  1. This should take about 5 minutes.
  2. Recipe End will appear in recipe box once vent is complete
  1. Remove Wafer Carrier from LL.
  1. Remove wafer/sample from Wafer Carrier.
  1. Align notch in Wafer Carrier with notch in the LL chamber.
  2. Run LL Pump.
  1. This process should take around 10 minutes.

Target requests

When requesting Lesker materials, please do both of the following on Badger:

1) Make a Badger Comment with the material request, date and any special notes (RF gun, High Strength Magnet, Co-Sputtering...).  Badger Comments will be used to determine the order requests are honored.

2) Add the materials to the Process field in the Reservation window.

Target changes are done Mon-Fri at 6am.  The Lesker sputterer requires at least two hours to pump down to base pressure after the target change is complete,.

Target request need to be made at least one business day before the change and are honored in the order they are entered in Badger.

Guns 1-3 share an RF Power supply.

Guns 1,3,4 share a DC Power supply.

Guns 5-8 share a DC power supply.

 

Precious Metal Sign out

We are recovering some of the precious metals cost for this tool. Prices for precious metals effective September 1, 2017:

 

Pt $0.70/nm

Au $0.90/nm

Pd $0.50/nm

 

After depositing these materials, the following procedure is REQUIRED each time you disable.

 

1. Open the Supplies signout window. (You can press F7 as a shortcut). Go to the nSiL tab.

2. Under 'Precious Metals' locate the materials you deposited. For 'Quantity' enter the total film thickness (in nm) and click 'Save & Close' (or 'Save & New' if you have multiple entries).

3. When you're done, you can 'Hide Supply Tree' under the 'Supplies' menu.

Updated 5/18/18  ms