Lesker Operation Manual

Lesker is a load locked single wafer metal sputter providing flexible processing options for non-CMOS compatible materials. The eight gun magnetron Lesker is classified as gold contaminated and provides non-directional thin film (< 1 um)

Contents

  1. Picture and Location
  2. Background
  3. Process Capabilities
  1. Cleanliness Standard: Flexible/Contaminated
  2. Performance of the Tool
  1. Contact List and How to Become a User
  1. Contact List
  2. Training to Become a Tool User
  1. Operating Procedures
  2. Process Monitoring and Machine Qualification
  1. Tool Qualification Run
  2. Machine Status States
  1. Target requests
  2. Precious Metal Sign out

Picture and Location

 

Lesker Sputter

 

The Lesker Sputter is located in nSiL at Paul Allen Building Room 155A.

 

Background

 

Lesker Sputter joined nSiL in January 2016.  

 

Process Capabilities

Cleanliness Standard: Flexible/Contaminated

The Lesker sputter is in the GOLD contaminated equipment group.  Substrates can come from any piece of equipment in the CLEAN, SEMICLEAN, or GOLD groups.  Most vacuum-compatible materials are allowed in this system.  Photo-resist is acceptable on wafers as long as it has been hard baked. Kapton tape is allowed for holding smaller samples to holder-wafers but should not be exposed to the sputter etch or elevated temperatures. Sodium and potassium-containing glasses are allowed. Most semiconductor materials, and high-vacuum compatible plastics are also acceptable. After deposition of ANY material in the Lesker (including aluminum), substrates are considered contaminated with gold and non-standard metals and can only go into other GOLD contaminated equipment.

 

Performance of the Tool

What the Tool CAN do

            The most current targets and locations are listed in Badger and on tool logbook.

 

What the Tool CANNOT do

Attached pieces thicker than 0.5 inch.

 

Contact List and How to Become a User

Contact List

The following people make up the Tool Quality Circle:

 

Training to Become a Tool User

Operating Procedures

 

Proper attire when using the tool includes:

 

Operating Procedure:

  1. Enable the tool on Badger.
  1. On Badger, Lesker Sputter can be found under the nSiL tab
  1. On the touch screen: Run LL Vent.
  1. This process should take around 5 minutes.
  1. Load wafer face down into the LL chamber. .
  1. If you are running a 6" wafer, an insert can be found in the basket under the load lock.
  1. Run LL Pump.
  1. This process should take around 8 minutes.
  1. Run Sample Load.
  1. Follow the directions on the recipe monitor window to load your sample. Lesker Sputter requires user action on the following steps. To move to the next step after you have performed the action, click the Resume button.
  2. Raise PC Z-shift all the way.
  1. This is done by turning the crank clockwise. The PC Z-shift should already be as high as possible, however, and should not need to be rotated.
  1. The machine then processes a few steps on its own.
  2. Raise LL Platen stage to fully extended.
  1. Turn the LL Platen crank clockwise to do so. It should raise a few turns.
  1. Extend LRP to LL transfer position.
  1. Turn the LRP crank clockwise. This should take around 15 rotations. Looking at the LRP location display, located on the front of the machine above and to the left of the keyboard, the fully extended distance is 826.
  2. the LRP Display can be seen in the following photo. The numbers in red indicate the distance.
  3. LRP Distance Display
  1. Lower LL Platen stage.
  1. This should take fewer than 2 full counterclockwise turns.
  1. Retract LRP to EOT position.
  1. This should take around 15 clockwise turns. Reading the LRP location display, home position is distance 0.
  1.  Wait for the machine to close the LL valve.
  2.  Lower PC Z-shift.
  1. Turn the PC Z-shift handle counterclockwise until it is at the 12:00 position. Then, rotate the handle counterclockwise rotations until height position reads -1.20.
  1.  Extend LRP to PC Z-shift position.
  1. This takes around a half-dozen clockwise rotations. On the LRP location display, this is achieved at a distance of 253.
  1. Raise PC Z-shift until the substrate holder is transferred from LRP to plate at height position reads -0.85.
  1. Rotate the PC-Z shift crank clockwise slowly. Watch through the viewing pane until the wafer holder starts to raise with the PC Z- shift and comes off the LRP.
  1. Retract LRP to EOT position.
  1. Watch through chamber viewing pane to ensure a clean retraction. The proper distance on the display is again 0.
  1. Raise PC Z-shift to fully retracted.
  1. This takes around 9 clockwise rotations.
  1.  The sample load recipe now complete. Be sure to close the viewing pane before running a deposition.
  2. Run desired recipe.
  1. On the touch screen, select Run Recipe.
  2. Choose recipe.
  1. From the dropdown menu, select a Master Recipe with your desire Source # (target #). Make sure the recipe is downstream control.
  1. Change desired recipe parameters.
  1. Type in numbers via the keyboard, and hit continue load when done.
  1. The recipe will now run. Make sure thew viewing pane is closed during deposition.
  1. Run Sample Unload when the recipe is complete.
  1. Raise PC Z-shift to fully retracted.
  1. Attempt gently to turn the handle clockwise, but the PC Z-shift should be at the top already.
  1. At this point the machine will run some processes by itself for a minute or two.
  2. Lower PC Z-shift to align with LRP.
  1. Again, starting with the handle at the 12:00 position, rotate counterclockwise rotations until plate height position reads -0.85.
  1. Extend LRP to PC Z-shift position.
  1. On the display, this is achieved at a distance of 253. Watch through the viewing pane to ensure proper positioning.
  1. Lower PC-Z shift to transfer substrate holder from PC Z-shift to LRP
  1. Lower the  PC Z-shift slowly, around a single counterclockwise rotation of the handle. Watch through the viewing pane to ensure proper transfer.
  1. Retract LRP to EOT Position.
  1. Rotate clockwise until the display reads a distance of 0.
  1. Raise PC Z-shift to fully retracted position.
  1. This should take around 10 complete clockwise rotations.
  1. The machine will now release the load lock.
  2. Lower LL Platen stage.
  1. Attempt to turn the handle counterclockwise, but it should already be in the lowest position.
  1. Extend LRP to LL transfer position.
  1. This should take around 15 counterclockwise rotations. This is achieved at a distance of 833 on the display.
  1. Raise LL Platen stage to fully extended.
  1. This should take several clockwise rotations. Watch through the LL to ensure the substrate holder has transferred properly.
  1. Retract LRP to EOT position
  1. Rotate clockwise until the display reads a position of 0 (from 833).
  1. Lower LL Platen stage.
  1. This takes several counterclockwise turns.
  1. Run LL Vent.
  1. This should take about 5 minutes.
  1. You may now remove your wafer.
  1. If possible, please load a dummy wafer into the load lock.
  1. Run LL Pump.
  1. This process should take around 10 minutes.

Target requests

When requesting Lesker materials, please do both of the following on Badger:

1) Make a Badger Comment with the material request, date and any special notes (RF gun, High Strength Magnet, Co-Sputtering...).  Badger Comments will be used to determine the order requests are honored.

2) Add the materials to the Process field in the Reservation window.

Target changes are done Mon-Fri at 6am.  The Lesker sputterer requires at least two hours to pump down to base pressure after the target change is complete,.

Target request need to be made at least one business day before the change and are honored in the order they are entered in Badger.

Guns 1-3 share an RF Power supply.

Guns 1,3,4 share a DC Power supply.

Guns 5-8 share a DC power supply.

 

Precious Metal Sign out

We are recovering some of the precious metals cost for this tool. Prices for precious metals effective September 1, 2017:

 

Pt $0.70/nm

Au $0.90/nm

Pd $0.50/nm

 

After depositing these materials, the following procedure is REQUIRED each time you disable.

 

1. Open the Supplies signout window. (You can press F7 as a shortcut). Go to the nSiL tab.

2. Under 'Precious Metals' locate the materials you deposited. For 'Quantity' enter the total film thickness (in nm) and click 'Save & Close' (or 'Save & New' if you have multiple entries).

3. When you're done, you can 'Hide Supply Tree' under the 'Supplies' menu.