[SEMI Standards] Survey for a Standardization Topic: “450mm Process Module Physical Interface”

International Process Module Physical Interface (IPPI) Task Force Dear Sir or Madam: The international Process Module Physical Interface Task Force (IPPI TF) requests a couple of minutes of your time. We are presently considering standardization of the process module physical interfaces that are for use in cluster tool type 450mm equipment. The standardization is intended to assist connection as well as wafer transport between transport module and other modules interfacing with the transport module (hereinafter represented by “process or load-lock modules”), but shall not unduly restrict design of module content. Proposals for possible standardization items are: - Mechanical Interface: interface plane between transport module and process or load-lock modules, wafer transport plane in transport module and process or load-lock modules. - Transport Module End Effector Exclusion Volume: The volume within process or load-lock module which shall (in some case, should) be accessible to the transport module end effector, restriction on transport module end effector design. This survey is distributed to IC device manufacturers, suppliers of semiconductor manufacturing equipment and load port suppliers for their inputs on this proposal of 450mm process module physical interface related standards to determine which specification should be standardized and to what extent. The IPPI TF encourages feedback on the need for these standards and the anticipated requirements in a production 450mm factory. The results of this survey will be reported at the 450mm IPPI TF meeting during 2012 Spring SEMI North America Standard Meetings. Thank you very much in advance for your support. February, 2012

1. About Youself








II. 300mm Experience

(Slide 4-8 of the Attachment-1 include Figures that indicate what are specified in E21.1 &E22.1) Please copy and paste the following URL into an another browser. [The Attachment-1] http://www.semi.org/jp/sites/semi.org/files/images/450PM%20Physical%20IF%20Standardization%20Survey%20Attachment-1.pdf



III. 450mm Wafer Transport Plane Elevation

See Attachment-1 for the summary of Proposal A & B. See Attachment-2 and -3 for technical principles behind each Proposal. Please copy and paste the following URL into an another browser. [The Attachment-1] http://www.semi.org/jp/sites/semi.org/files/images/450PM%20Physical%20IF%20Standardization%20Survey%20Attachment-1.pdf [The Attachment-2] http://www.semi.org/jp/sites/semi.org/files/images/Survey%20Attachment-2%20%28ProposalA%29.pdf [The Attachment-3] http://www.semi.org/jp/sites/semi.org/files/images/Survey%20Attachment-3%20%28ProposalB%29.pdf




IV. Mechanical Interface Plane

See Attachment #1 for the summary of Proposals A&B Please copy and paste the following URL into an another browser. [The Attachment-1] http://www.semi.org/jp/sites/semi.org/files/images/450PM%20Physical%20IF%20Standardization%20Survey%20Attachment-1.pdf










V. Transport Module End Effector Exclusion Volume

See Attachment-1 for the summary of Proposals A&B Please copy and paste the following URL into an another browser. [The Attachment-1] http://www.semi.org/jp/sites/semi.org/files/images/450PM%20Physical%20IF%20Standardization%20Survey%20Attachment-1.pdf




VI. Standard Adoption





VII. Others



Please click the submit button below. Thank you for your cooperation. (If you have any questions, please contact to Hirofumi Kanno (SEMI Japan) at hkanno@semi.org.)

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